DES (Developing, Etching, Stripping) Line
    • DES (Developing, Etching, Stripping) Line

    DES (Developing, Etching, Stripping) Line

    In the printed circuit board (PCB) manufacturing industry, automated developing, etching, and stripping equipment stands as a classic mainstay. The developing, etching, and stripping machine produced by Super Equipment is a prime example within this field. This model not only achieves efficient and precise execution of these three critical processes but also excels in performance stability and high-precision etching. We focus on energy conservation, economic efficiency, and ease of operation, providing users with an optimal experience.


    In the printed circuit board (PCB) manufacturing industry, automated developing, etching, and stripping equipment stands as a classic mainstay. The developing, etching, and stripping machine produced by Super Equipment is a prime example within this field. This model not only achieves efficient and precise execution of these three critical processes but also excels in performance stability and high-precision etching. We focus on energy conservation, economic efficiency, and ease of operation, providing users with an optimal experience.

    Embracing the concept of Industry 4.0, Super Equipment's developing, etching, and stripping machine is equipped with advanced programmable digital output interfaces, facilitating seamless integration with a company’s ERP system for streamlined and intelligent production line management. This not only simplifies the production process but also enhances overall operational efficiency, enabling customers to maintain a leading edge in the competitive market.


    Features

    1. Etching Line Width/Spacing: 2mil/2mil, Etching Evenness C.O.V≥96%, Etching factor ≥ 4.

    2. Precision etching design that it is effective to control the puddle effect and improve the evenness of the panel.

    3. Spraying system, medicine circulation system and unique design of dregs-collection system are used in film stripping module to remove up to 98% of the dregs.

    4. Developing features: trace width/spacing: 25μm/25μm.

    5. Etching features:

    1/3 oz copper trace width/ spacing: 30μm/30μm

    ½ oz  copper trace width/ spacing: 50μm/50μm

    1 oz copper trace width/ spacing: 75μm/75μm

    Etching uniformity ≥ 95%

    Etching factor  ≥  3.0

    6. Membrane slag filtering effect≥98%


    Procedure

    Load → Developing → Fresh Solution → Waste water discharge  →  Circulation water rinsing  → Inspection → Compensated etching → Etching → Circulation Water rinsing → Inspection → Film Stripping → Waste water discharge → Circulation water rinsing → Acid rinse → Circulation water rinsing → Drying → Unload

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