OSP (Organic Solderability Preservation) Line
    • OSP (Organic Solderability Preservation) Line

    OSP (Organic Solderability Preservation) Line

    To prevent the copper foil from oxidizing during subsequent processing, the OSP (Organic Solderability Preservation) line plays a very important role.


    To prevent the copper foil from oxidizing during subsequent processing, the OSP (Organic Solderability Preservation) line plays a very important role. The design has been meticulously crafted to prioritize product quality, manufacturing efficiency, environmental sustainability, ease of operation and maintenance, safety protections, and user-friendly identification. By taking a holistic and optimized approach that addresses all practical considerations, we aim to deliver high-value products to our customers.


    Features

    1. The transparent glass enclosure makes it convenient to observe the panels while on the move.

    2. The high-footed design, with the drainage piping positioned at the rear, facilitates 7S production.

    3. Water knives specifically designed for immersive conditions take full advantage of low pressure to maximize infiltration flow, ensuring the smoothness of the surface.


    Procedure

    Load → Degreasing → Circulation HF water resine → Fresh water rinse  → Microetching → Circulation water rinse → Fresh water rinse → Pressured air blowing → OSP → Circulation water risne  → Fresh water rinse → Drying → Cooling → Unload



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